SiTest Solutions Ltd.

Silicon Solutions, Services & Strategies

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Providing Silicon Solutions, Services & Strategies

to customers worldwide
 

Headquartered in Hong Kong, SiTest Solutions Ltd. provides semiconductor Packaging & Test Engineering Services and Solutions.
We specialize in:
  • Packaging Engineering Services (design, characterization, material selection, proto-type assembly)
  • Production Test Solutions for lowering Cost-of-Test
  • Metrics & Strategies for lowering Cost-of-Manufacturing
  • Full turn-key Engineering Services  (proto-type to full volume production)
  • Technological Link between Customer & Asia Factories

 

We support your device from New Product Introduction to Mass Volume Production

 

 

Key Technological Services & Advantages

 

SiTest Solutions Advantage

We focus on providing technical support for semiconductor companies using high volume Assembly & Test factories in Asia / China.  SiTest Solutions has strong technical Package, Test & Product Engineering teams with language skills to complement -- fluent in English, Mandarin, Cantonese, Tagalog, and Thai.  We become an extension of our customers'  Engineering & Product Engineering Teams -- their resident manufacturing engineers in the Asian-based EMS/OSAT Subcontractor..

We are our customers' advocate in the factory.

 

Technical Conduit to China

We can provide direct access to any region in China, from Shenzhen to Shanghai, Beijing to Chengdu.  Our Engineering facility in Hong Kong is conveniently located on the Hong Kong train line direct to Shenzhen. 

We provide timely response & improved quality of communications to our customers.

 

Test Support from DFT to Volume Production

Our Manufacturing & Product Engineering team can assist in Design-For-Test (DFT) and Design-For-Manufacturing (DFM) of your new design, and then when the proto-type is available we can evaluate & characterize the new product at both a wafer and package level.  Electrical test, ESD & Latch-Up studies, Reliaibility testing can all be performed on the new device.  SiTest Solutions will continue to support the device during engineering sample & initial ramp production with our in-house capabilities.  Given our alliances with our EMS/OSAT production companies in Asia, we can easily transfer and monitor your product during mass volume production.  

 

> Download SiTest Solutions Newsletter   September-2009  

 

> Download   Services & Capabilities

  

> Download SiTest Solutions Company Presentation  Feb-2009 

 

> Download SiTest Solutions Brochure      August-2009         

 

TEST SERVICES
 
 
 
 
 
 
 
 
 
We have the following Test Capabilities:
  • Program Development
  • Hardware Design
  • Loadboards & Socket
  • Characterization
  • Proto-type Analysis
  • Production Testing

 

TEST EXPERTISE
 
 
 
 
 
 
 
 
  • RF devices
  • Mixed-signal ICs
  • High-Speed Digital
  • Memory
   ISO9001:2000 CERTIFICATION
     
               ISO-9001:2000
             Cert No 1210032037
 
 
 
  UPDATES & NEWS    
  JANUARY 2010 

NEECC 2009 Manila, PH
    IEEE Conference
    National Electronical, Electronics
    and Computing Conference
    9-11 DECEMBER
    Plenary Session: Circuits & Systems
 
Packaging Services
    Design,Material Selection, Proto-Types
    MEMs packaging support
    SIP (System-In-Package) support
    Package & Subcontractor Selection
   
Solid State Drive (SSD)
    Full Electrical Testing
     Speed / File Transfer Analysis
     Reliability Testing / Qualification
     Intelligent (real-time) Burn-In