SiTest Solutions Ltd.

Silicon Solutions, Services & Strategies

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Silicon Solutions, Services & Strategies

to customers worldwide
 

Headquartered in Hong Kong, SiTest Solutions Ltd. provides semiconductor Packaging & Test Engineering Services.
 
We specialize in:
  • Metrics & Strategies for lowering Cost-of-Manufacturing
  • Packaging Engineering Services (design, characterization, material selection, proto-type assembly)
  • Production Test Solutions for lowest Cost-of-Test
  • Full turn-key Engineering Services  (proto-type to full volume production)
  • Technological Link between Customer & Asia Factories

 

We support your device from New Product Introduction to Mass Volume Production

 

 

Key Technological Services & Advantages

 

SiTest Solutions Advantage

We can provide low-volume / specialty manufacturing (packaging + test + back-end services) or help you by providing technical support for your high volume Assembly & Test at a subcontractor in Asia / China.  SiTest Solutions has strong technical Package, Test & Product Engineering teams with language skills to complement -- fluent in multiple languages.  We become an extension of our customers'  Engineering & Product Engineering Teams -- their resident manufacturing engineers in the Asian-based EMS/OSAT Subcontractor..

We are our customers' advocate in the factory.

 

Technical Conduit to China

We can provide direct access to any region in China, from Shenzhen to Shanghai, Beijing to Chengdu.  Our Engineering facility in Hong Kong is conveniently located on the Hong Kong train line direct to Shenzhen. 

 

Test Support from DFT to Volume Production

Our Manufacturing & Product Engineering team can assist in Design-For-Test (DFT) and Design-For-Manufacturing (DFM) of your new design.  We can package the new product and then evaluate & characterize at both the wafer and package level.  Electrical test, ESD & Latch-Up studies, as well as Reliaibility testing can all be performed.  SiTest Solutions will continue to support the device during engineering sample & initial ramp production with our in-house capabilities.  Given our alliances with EMS/OSAT high-volume production companies in Asia, we can easily transfer and monitor your product during mass volume production.  

 

     > Download SiTest Solutions Newsletter   (September-2009)  

  

     > Download SiTest Solutions Company Presentation  (Feb-2009) 

 

     > Download SiTest Solutions Brochure      (August-2009)         

 

TEST SERVICES
 
 
 
 
 
 
 
 
 
We have the following Test Capabilities:
  • Program Development
  • Hardware Design
  • Loadboards & Socket
  • Characterization
  • Proto-type Analysis
  • Production Testing

 

TEST EXPERTISE
 
 
 
 
 
 
 
 
  • RF devices
  • Mixed-signal ICs
  • High-Speed Digital
  • Memory
   ISO9001:2000 CERTIFICATION
     
               ISO-9001:2000
             Cert No 1210032037
 
 
 
  UPDATES & NEWS    
  SEPTEMBER 2010 

Packaging Services
    Multi-Chip-Modules (MCMs)
    MEMs packaging support
    FBGA, QFN packages
    Low volume & Engineering lots
   
 
New Number
    Office Phone:  (+852) 3980-9230
                   Fax:  (+852) 3980-9333