SiTest Solutions
a Technology Consulting Company
Located in Hong Kong, SiTest Solutions Ltd. provides semiconductor Technology Solutions & Services.
Metrics & Strategies for lowering Cost-of-Manufacturing
Package Engineering Services (design, characterization, material selection, proto-type assembly) - Multi-Chip Modules, QFN, FBGA, MEMS, CIS
Production Test Solutions for lowest Cost-of-Test
Technological Link to Asia-based Factories
Industrial & Automotive Screening
Reliability Studies (Operative Life Test HTOL, Temperature Cycling, 85/85)
Failure Analysis (SEM/EDX, X-ray, Decapsulation, Cross-Sectioning)
Application Support in Asia
Key Technological Services & Advantages
SiTest Solutions Advantage We provide specialty manufacturing (packaging + test + back-end services) and also help by providing technical support at subcontractors located in Asia / China. SiTest Solutions has strong technical Manufacturing, Packaging, Test & Product Engineering expertise with language skills to complement -- fluent in English, Mandarin, and Cantonese.
Technical Conduit to China
Our Engineering facility in Hong Kong is conveniently located on the Hong Kong train line direct to Shenzhen. We easily support product logistically that requires a final destination in China (Beijing, Shanghai, Chengdu).
Manufacturing Expertise
Our Manufacturing Engineering teams have expertise in Design-For-Test (DFT) and Design-For-Manufacturing (DFM) for new designs. We have the capability to develop new package designs, and then evaluate & characterize at both the wafer and package level. Electrical Test, ESD & Latch-Up studies, as well as Reliaibility testing can all be performed. Given our alliances with EMS/OSAT high-volume production facilities in Asia, we can easily transfer and monitor product during mass volume production.